Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Sangjik Lee and Sukhoon Jeong and Kihyun Park,Kinematical modeling of pad profile variation during conditioning in chemical mechanical polishing,Japanese journal of applied physics : JJAP,00214922,Tokyo : The Japan Society of Applied Physics,2009-12,48,12,126502,https://cir.nii.ac.jp/crid/1520853833165163648,https://doi.org/10.1143/jjap.48.126502