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4-2 Soldering microelectronic assemblies : some problems and studies(Session 4 : New Joining Processes for Advanced Materials,SIMAP'88 Proceedings of International Symposium on Strategy of Innovation in Materials Processing-New Challenge for the 21st Century-)

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Abstract

In the application of SMT, the provision of highly solderable surfaces on component terminations and circuit boards is still a primary requirement for reliability. Checking of solderability of components is desirable but methods for this have not been perfected because of the small size of components. Visual inspection is becoming extremely difficult, if not impossible, and reliance must therefore be placed on using surfaces of good solderability and close control of the soldering processes.

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Details

  • CRID
    1570009752371643136
  • NII Article ID
    110006486787
  • NII Book ID
    AA00867058
  • ISSN
    03874508
  • Text Lang
    en
  • Data Source
    • CiNii Articles

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