Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
KIM T. H.,"Wafer-scale surface activated bonding of silicon, silicon oxide and copper at low temperature","7th Int. Symposium on Semiconductor Wafer Bonding Science, Technology, and Applications, Paris, France, April/May 2003",,,2003,1040,,,https://cir.nii.ac.jp/crid/1570291226082659840,