著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI) BAR-COHEN A.,Thermal Frontiers in the Design and Packaging of Microelectronic,Equipment Mechanical Engineering,,,1983,150,,53,https://cir.nii.ac.jp/crid/1570572699153144192,