Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
FUKUSHIMA Takafumi and YAMADA Yusuke and KIKUCHI Hirokazu and KOYANAGI Mitsumasa,New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration,Extended abstracts of the ... Conference on Solid State Devices and Materials,,,2005-09-13,2005,,64-65,https://cir.nii.ac.jp/crid/1570572700671647872,