Alignment-Free Optical Modules Using Solder-Bump-Bonding Technique for Free-Space Optical Interconnections
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- MIYAZAKI Daisuke
- Deptartment of Physical Electronics and Informatics, Graduate School of Engineering, Osaka City University
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- OHNO Yuji
- Deptartment of Physical Electronics and Informatics, Graduate School of Engineering, Osaka City University
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- MATSUSHITA Kenji
- Deptartment of Physical Electronics and Informatics, Graduate School of Engineering, Osaka City University
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収録刊行物
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- Optical review
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Optical review 15 (1), 19-25, 2008-02-01
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詳細情報 詳細情報について
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- CRID
- 1571980075516449280
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- NII論文ID
- 10021106654
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- NII書誌ID
- AA11029291
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- ISSN
- 13406000
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- 本文言語コード
- en
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- データソース種別
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- CiNii Articles