著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
ZHAI C. J.,Investigation of Cu/low-k film delamination in flip chip packages,"Proc. 56th Electronic Components and Technol. Conf., 2006",,,2006,,,709-717,https://cir.nii.ac.jp/crid/1571980075778927744,