著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
TANG Mao-Chyuan and WANG Meng-Feng and CHENG Tim and CHEN David and YEH C S and CHIEN S C,Non-destructive extraction of width bias variations for deep sub-micron interconnect lines,Extended abstracts of the ... Conference on Solid State Devices and Materials,,,2007-09-19,2007,,398-399,https://cir.nii.ac.jp/crid/1572261550532543360,