Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
小形 喜一,"Kim,B.H., Bang,Y.T., Kang,J.N. et al. : Measurement of Junction Temperature and Thermal Resistance of Multi-chip LED Package [Proceedings of the 5th Lighting Conference of China, Japan and Korea, pp.357-360(2012)]",Journal of the Illuminating Engineering Institute of Japan,00192341,The Illuminating Engineering Institute of Japan (IEIJ),2013-01-01,97,1,41,https://cir.nii.ac.jp/crid/1572543027801774080,