Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
FUKUNAGA A. and NAGAI M. and SAITOH N. and ARAKI Y. and 赤澤 賢一 and KURIYAMA F. and OWATARI A.,Cu Electroplating for Through Silicon Via,半導体・集積回路技術シンポジウム講演論文集,,,2008-07-10,72,,49-51,https://cir.nii.ac.jp/crid/1573105976072108544,