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Solid State Reaction Bonding of Non-Oxide Ceamics to Metals (Report I) : Bonding of Si_3N_4 to Al Alloys(Materials, Metallurgy & Weldability)

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Abstract

The solid state reaction bonding of Si_3N_4 to Al alloys (A1050 and AC-8A) is studied. The bonding was done in vacuum (7×10^<-3>Pa) changing bonding temperature (627-877K), bonding time (0-180min) and bonding pressure (0-350MPa) respectively. The strength of bonded joint between Si_3N_4 and Al alloy increases with the increase of bonding temperature, bonding time and bonding pressure respectively. The reaction between Si_3N_4 and aluminum is studied by using QMS (Quadrupole Mass Spectrometer) and XRD (X-ray Diffraction). Si_3N_4 reacted with aluminum at 1273K to give AlN and Si. The solid state reaction bonding of Si_3N_4 to Al alloy may be due to the formation of AlN and Si at the interface.

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Details

  • CRID
    1573105977115624960
  • NII Article ID
    110006486638
  • NII Book ID
    AA00867058
  • ISSN
    03874508
  • Text Lang
    en
  • Data Source
    • CiNii Articles

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