Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
HAYASHI Tsuyoshi and TSUNETSUGU Hideki,Optical module with MU connector interface using self-alignment technique by solder-bump chip bonding,IEICE technical report. Component parts and materials,,"The Institute of Electronics, Information and Communication Engineers",1996-08-20,96,218,49-54,https://cir.nii.ac.jp/crid/1573105977189841792,