著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
KADA M.,"Advancements in Stacked Chip Scale Packaging (S-CSP), Provides System-in-a-Package Functionality for Wireless and Handheld Applications",Proceedings of the Pan Pacific Microelectronics Symposium 2000,,,2000,,,,https://cir.nii.ac.jp/crid/1573387451526479744,