Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
UEOKA Y. and KATO Y. and KONO E. and HAGIMOTO E.,Solder Bump Forming using Micro Punching Technology,電子情報通信学会秋季大会講演論文集,,"The Institute of Electronics, Information and Communication Engineers",1994-09-26,1994,2,27,https://cir.nii.ac.jp/crid/1574231877156675968,