Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Naoya Hirota and Masaya Kawano and Sharon Pei Siang Lim and S. C. Chong,Ultrathin Die Pick-Up for 3D Chip Stacking,2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),,IEEE,2019-12-01,,,171-174,https://cir.nii.ac.jp/crid/1870302167634222208,https://doi.org/10.1109/eptc47984.2019.9026703