Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
T. Ohta and S. Sunada and V. Vezin and K. Shigama and Eiichi Kondoh and K. Kubo,Paving the way for full-fluid IC metallization using supercritical carbon dioxide,Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695),,IEEE,2004-03-22,,,141-143,https://cir.nii.ac.jp/crid/1870865117629728640,https://doi.org/10.1109/iitc.2003.1219736