著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
T. Nishioka and Y. Akada and Kazuhiro Ikemura and M. Sano and S. Ito,Multi layer film adhesive for IC packaging applications,1995 Proceedings. 45th Electronic Components and Technology Conference,,IEEE,2002-11-19,,,688-691,https://cir.nii.ac.jp/crid/1871428067883323520,https://doi.org/10.1109/ectc.1995.517763