Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Yoshinori Noguchi and Maeda Keiji and Satoshi Kitaoka and Naoki Kawashima and Takaki Kuno,Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds,Materials Science Forum,1662-9752,Trans Tech Publications Ltd.,2007-10-02,561-565,,539-542,https://cir.nii.ac.jp/crid/1872835442425891840,https://doi.org/10.4028/0-87849-462-6.539