Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
K. Sekiya and Keiji Yamada and A. Hosokawa and Takashi Ueda and Yasuo Yamane,Thermal damage of silicon wafer in thermal cleaving process with pulsed laser and CW laser,SPIE Proceedings,0277-786X,SPIE,2006-02-09,6107,,61070H,https://cir.nii.ac.jp/crid/1872835442556165632,https://doi.org/10.1117/12.644564