Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
Satake and Sekiguchi and Mayumi and Tamaki and Hirao and Kamada,A Novel Copper Reflow Process Using Dual Wetting Layers,Symposium on VLSI Technology,,IEEE,1997-01-01,,,57-58,https://cir.nii.ac.jp/crid/1872835442557701632,https://doi.org/10.1109/vlsit.1997.623693