著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Tomoyuki Abe and Miki Inamura and Hiroshi Uemura and Yasuhide Kakumoto and Yoichiro Kurita and Hideto Furuyama and Fumitaka Ishibashi,III–V/Si Chip-on-Wafer Direct Transfer Bonding technology (CoW DTB); process capabilities and bonded structure characterizations,2016 6th Electronic System-Integration Technology Conference (ESTC),,IEEE,2016-09-01,,,1-6,https://cir.nii.ac.jp/crid/1872835442561550080,https://doi.org/10.1109/estc.2016.7764692