著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Masumi Saka and Hironori Tohmyoh,Solder-joint inspection using dry-contact ultrasonic device,"2002 IEEE Ultrasonics Symposium, 2002. Proceedings.",,IEEE,2003-10-01,,,819-822,https://cir.nii.ac.jp/crid/1872835442584553472,https://doi.org/10.1109/ultsym.2002.1193523