Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
S. Ito and Makoto Kuwamura and Masaki Mizutani and Hiroshi Noro and H. Usui,Study of reliability and process ability for preset underfill sheet material as future standard flip chip packaging process,2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070),,IEEE,2002-11-07,,,319-322,https://cir.nii.ac.jp/crid/1872835442646093696,https://doi.org/10.1109/ectc.2000.853170