著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Yasuhiro Horiike and Shoso Shingubara and H. Nishida and A. Fukukawa and Hiroyuki Sakaue,Observation of a copper-aluminum precipitate electromigration in a submicron width aluminum interconnection,1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference,,IEEE,2002-12-09,,,265-271,https://cir.nii.ac.jp/crid/1872835443128902016,https://doi.org/10.1109/vmic.1991.152998