著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
M. Ishizuka and Y. Yokono,Thermal studies of finned LSI packages under forced convection,Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium,,IEEE,1989-01-01,,,20-24,https://cir.nii.ac.jp/crid/1873116917295076608,https://doi.org/10.1109/stherm.1989.76060