著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Kenta Ono and Atsushi Fujii and Yoshiharu Kariya and Yuji Okada,Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level Packaging,International Symposium on Microelectronics,2380-4505,IMAPS - International Microelectronics Assembly and Packaging Society,2020-09-01,2020,,000094-000099,https://cir.nii.ac.jp/crid/1873116917766794624,https://doi.org/10.4071/2380-4505-2020.1.000094