Author,Title,Journal,ISSN,Publisher,Date,Volume,Number,Page,URL,URL(DOI)
T. Osaka and Hiroyuki Sakaue and S. Kajiwara and Takayuki Takahagi and S. Shingubara,Void Elongation Phenomena Observed in Polycrystalline Cu Interconnects at a High Current Density Stressing Conditions,MRS Proceedings,0272-9172,Springer Science and Business Media LLC,1997-01-01,473,,,https://cir.nii.ac.jp/crid/1874242817400972800,https://doi.org/10.1557/proc-473-229