著者名,論文名,雑誌名,ISSN,出版者名,出版日付,巻,号,ページ,URL,URL(DOI)
Hideki Kiritani and Makoto Ikemoto and Sugiyama Masaya and Yasuhiro Kawase and Hidehiro Yamamoto,Pre-Applied Inter Chip Fill for 3D-IC Chip Joining,"Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales",,American Society of Mechanical Engineers,2015-07-06,,,,https://cir.nii.ac.jp/crid/1874242817829678208,https://doi.org/10.1115/ipack2015-48738