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A 33% Improvement in Efficiency of Wireless Inter-Chip Power Delivery by Thin Film Magnetic Material for Three-Dimensional System Integration

Bibliographic Information

Title
A 33% Improvement in Efficiency of Wireless Inter-Chip Power Delivery by Thin Film Magnetic Material for Three-Dimensional System Integration
Author
Kiichi Niitsu, Hiroki Ishikuro, Tadahiro Kuroda, et al.

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Details

  • CRID
    1010000782453978753
  • Article Type
    journal article
  • Data Source
    • KAKEN
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