Effects of additives on copper electrodeposition in submicrometer trenches
Bibliographic Information
- Title
- Effects of additives on copper electrodeposition in submicrometer trenches
- Author
- Madoka Hasegawa, Tetsuya Osaka
Journal
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- J.Electrochem.Soc. 152
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J.Electrochem.Soc. 152 2005
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Details
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- CRID
- 1010000781773782564
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- Article Type
- journal article
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- Data Source
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- KAKEN