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Effects of additives on copper electrodeposition in submicrometer trenches
Bibliographic Information
- Title
- Effects of additives on copper electrodeposition in submicrometer trenches
- Author
- Madoka Hasegawa, Tetsuya Osaka
Journal
-
- J.Electrochem.Soc. 152
-
J.Electrochem.Soc. 152 2005
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Details 詳細情報について
-
- CRID
- 1010000781773782564
-
- Article Type
- journal article
-
- Data Source
-
- KAKEN
