Effects of additives on copper electrodeposition in submicrometer trenches
書誌事項
- タイトル
- Effects of additives on copper electrodeposition in submicrometer trenches
- 著者
- Madoka Hasegawa, Tetsuya Osaka
収録刊行物
-
- J.Electrochem.Soc. 152
-
J.Electrochem.Soc. 152 2005
