Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints
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- 于 強
- 横浜国立大学
書誌事項
- タイトル
- Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints
- 著者
- 于強
収録刊行物
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- Microelectronics Reliability 48
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Microelectronics Reliability 48 431-437, 2007