Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structure
-
- 三浦 英生
- 東北大学
書誌事項
- タイトル
- Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structure
- 著者
- Seongcheol Jeong, Naokazu Murata, Yuki Sato, Ken Suzuki, Hideo Miura
収録刊行物
-
- Transaction of the Japan Institute of Electronics Packaging 2
-
Transaction of the Japan Institute of Electronics Packaging 2 91-97, 2009