Low-temperature bonding of laser diode chips using atmospheric-pressure plasma activation of flat topped Au stud bumps with smooth surfaces
書誌事項
- タイトル
- Low-temperature bonding of laser diode chips using atmospheric-pressure plasma activation of flat topped Au stud bumps with smooth surfaces
- 著者
- Michitaka Yamamoto, Takeshi Sato, Eiji Higurashi, Tadatomo Suga, and Renshi Sawada
収録刊行物
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- Proceedings of IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan
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Proceedings of IEEE CPMT (Components, Packaging, and Manufacturing Technology) Symposium Japan なし 35-38, 2012