3D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link
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- 新津 葵一
- 慶應義塾大学
書誌事項
- タイトル
- 3D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link
- 著者
- Makoto Saen, Kiichi Niitsu, Tadahiro Kuroda, et al.
収録刊行物
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- IEEE Journal of Solid-State Circuits (掲載決定)
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IEEE Journal of Solid-State Circuits (掲載決定) 2010