Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process

Bibliographic Information

Title
Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process
Author
Y.Xu, C.Wang, Y.Dong, L.Li, K.Jang, K.Mawatari, T.Suga, T.Kitamori

Journal

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Details

  • CRID
    1010282257038270605
  • Article Type
    journal article
  • Data Source
    • KAKEN

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