Cell encapsulation and 3D self-assembly using multi-layered polymeric thin films
Open Access
Bibliographic Information
- Title
- Cell encapsulation and 3D self-assembly using multi-layered polymeric thin films
- Author
- T. Teshima, H. Nakashima, Y. Ueno, S. Sasaki, C. S. Henderson, S. Tsukada
Journal
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- NTT Technical Review
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NTT Technical Review 16 53-61, 2018
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Details
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- CRID
- 1010848250496363520
-
- Article Type
- journal article
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- Data Source
-
- KAKEN