書誌事項
- タイトル別名
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- Warp Deformation Behavior in Chemical Curing Process ofViscoelastic Laminated Beam Composed of Epoxy Resin and Steel
- エポキシ ジュシ ト コウザイ カラ ナル ネンダンセイ セキソウ ハリ ノ コウカ カテイ ニ オケル ソリ ヘンケイ キョドウ
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説明
Epoxy resin is usually used as a encapsulation of IC chips for electronic parts. It is transformed from liquid to solid by the chemical curing reaction,and then residual stresses and warp deformation are generated in the electronic parts. In this report,the warp deformation behavior of laminated beam caused by the chemical curing process of epoxy resin was examined from both sides of the experiment and theory, which are the thermo-viscoelastic numerical analysis based on the linear viscoelasticity theory and the Finite Element Analysis about the laminated beam consisting of epoxy resin and steel. As a result, it was clarified that the result of thermo-viscoelastic numerical analysis of warp deformation well accorded with the experimental values,and the warp deformation behavior could be predicted by the thermo-viscoelastic numerical analysis with precision which is effedive in practical use.
収録刊行物
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- 広島工業大学紀要. 研究編
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広島工業大学紀要. 研究編 42 25-31, 2008-02
広島工業大学
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キーワード
詳細情報 詳細情報について
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- CRID
- 1050014282714999552
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- NII論文ID
- 40015883240
- 120005403500
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- NII書誌ID
- AA11599110
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- ISSN
- 13469975
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- NDL書誌ID
- 9387192
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- 本文言語コード
- ja
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- 資料種別
- departmental bulletin paper
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- データソース種別
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- IRDB
- NDL
- CiNii Articles