粉末フェノール樹脂接着剤を用いたパーティクルボード

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Other Title
  • 粉末フェノール樹脂接着剤を用いたパーティクルボード(林学部門)
  • フンマツ フェノール ジュシ セッチャクザイ オ モチイタ パーティクル ボー
  • Particleboards with powdered phenolic resin adhesive (Forestry)

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Ten-millimeter-thick single-layer particleboards were made with (a) powdered and (b) liquid phenolic resin adhesives, and the effects of moisture content of particles and resin content on physical and mechanical properties of the boards were investigated. The strand particles (0.5×3.2×48mm) were prepared from thinnings of Sugi (Cryptomeria japonica). The press time was 8 minutes at 180℃ and the pressure was 35kgf/cm^2. Target density of the board was 0.7g/cm^3. Values for MOR and MOE of the (a) boards increased sharply with increase in moisture content at all resin contents and the best results were attained with 20% moisture content (max.). This quantity of moisture is necessary to hold the powdered resin on particles, to effect adequate bonding of particles by the adhesive and also to plasticize wood. On the other hand, those of the (b) boards increased sharply with increase in resin contents from 5% to 8∿10% and reached optimum levels between 10 and 15% resin content. The same results were apparent for internal bond, except that the reveling-off tendency was less apparent. An advantage in using the powdered resin adhesive is that the moisture content of particles does not have to be lowered to 2 to 4% level. And also the powdered resin have many advantages : longer life, ease of transportation, etc.

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