Influence of source/drain parasitic resistance on device performance of ultrathin body 3-5 channel metal-oxide-semiconductor field-effect transistors

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  • Influence of Source/Drain Parasitic Resistance on Device Performance of Ultrathin Body III-V Channel Metal-Oxide-Semiconductor Field-Effect Transistors

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説明

The influence of source/drain (S/D) parasitic resistance in ultrathin body (UTB) III–V channel metal–oxide–semiconductor field-effect transistor (MOSFET) was investigated based on Monte Carlo simulation. We found that heavily doped S/D improves source starvation and suppresses carrier's backscattering from drain to channel, owing to increased electron–electron scattering. As a result, the heavily doped S/D was shown to be effective to enhance the current drive and transconductance of UTB III–V channel MOSFET. In addition, we demonstrated that the heavily doped S/D has the advantage to provide unsaturated drain current characteristics.

収録刊行物

  • Applied Physics Express

    Applied Physics Express 4 (8), 084301-084301(3), 2011-08-25

    The Japan Society of Applied Physics

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