A Virtual Prototyping Technique as a Design Method of Next Generation Power Supply and Design Consideration of the Switching Power Supply for Miniaturization using the Proposed Technique

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  • 次世代スイッチング電源の設計方法としてのVirtual Prototypingの提案とこれを用いたスイッチング電源の小型化の検討

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3D power IC, which integrates Si based IC and Gallium Nitride (GaN) power devices realizes high efficiency at high frequency switching and high-power density. However, miniaturization makes 3D power IC high temperature, and the interaction of electromagnetic field and heat are increased. In this paper, we propose a virtual prototyping technique, which is coupling of thermal-device, heat conduction, thermal-electromagnetic, and thermal-circuit simulation to design the 3D power IC. In addition, we introduce an example of design for miniaturization of power supply using virtual prototyping.

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