Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu<sup>2+</sup>-alkanolamine metallacycle compounds for electrically conductive layer formation
書誌事項
- タイトル別名
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- Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation
- 公開日
- 2016-01-29
- 資源種別
- journal article
- 権利情報
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- Creative Commons Attribution 3.0 Unported
- DOI
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- 10.1039/c5ra25058g
- 公開者
- Royal Society of Chemistry
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説明
A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 degrees C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 x 10(-6) Omega m). This novel process may open a new strategy in the field of printed electronics.
収録刊行物
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- RSC advances
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RSC advances 6 (15), 12048-12052, 2016-01-29
Royal Society of Chemistry
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詳細情報 詳細情報について
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- CRID
- 1050869456408632192
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- NII論文ID
- 120005722548
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- HANDLE
- 2115/60845
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- ISSN
- 20462069
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- 本文言語コード
- en
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- 資料種別
- journal article
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- データソース種別
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