切削方法の違いと接着材処理時間の短縮が象牙質の接着強さに与える影響についての検討

DOI DOI 機関リポジトリ (HANDLE) NDLデジタルコレクション NDLデジタルコレクション

書誌事項

タイトル
切削方法の違いと接着材処理時間の短縮が象牙質の接着強さに与える影響についての検討
タイトル別名
  • The effect of dentine surface preparation and reduced application time of adhesive on bond strength
著者
Saikaew, Pipop
学位授与大学
北海道大学
取得学位
博士(歯学)
学位授与番号
甲第13045号
学位授与年月日
2018-03-22

説明

Objective: This study evaluated the effects of surface preparation and the application time of adhesives on the resin-dentine bond strengths with universal adhesives. Methods: Sixty molars were cut to exposed mid-coronal dentine and divided into 12 groups (n = 5) based on three factors; (1) adhesive: G-Premio Bond (GP, GC Corp., Tokyo, Japan), Clearfil Universal Bond (CU, Kuraray Noritake Dental Inc., Okayama, Japan) and Scotchbond Universal Adhesive (SB, 3M ESPE, St. Paul, MN, USA); (2) smear layer preparation: SiC paper ground dentine or bur-cut dentine; (3) application time: shortened time or as manufacturer’s instruction. Fifteen resin-dentine sticks per group were processed for microtensile bond strength test (μTBS) according to non-trimming technique (1 mm2) after storage in distilled water (37 ℃) for 24 h. Data were analyzed by three-way ANOVA and Dunnett T3 tests (α = 0.05). Fractured surfaces were observed under scanning electron microscope (SEM). Another 12 teeth were prepared and cut into slices for SEM examination of bonded interfaces. Results: μTBS were higher when bonded to SiC-ground dentine according to manufacturer’s instruction. Bonding to bur-cut dentine resulted in significantly lower μTBS (p < 0.000). Shortening the application time resulted in significantly lower bond strength for CU on SiC and GP on bur-cut dentine. SEM of fractured surfaces revealed areas with a large amount of porosities at the adhesive resin interface. This was more pronounced when adhesives were bonded with a reduced application time and on bur cut dentine. Clinical significance: The performance of universal adhesives can be compromised on bur cut dentine and when applied with a reduced application time.

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