11th International Congress Molded Interconnect Devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg/Fuerth, Germany

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Bibliographic Information

Title
"11th International Congress Molded Interconnect Devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg/Fuerth, Germany"
Statement of Responsibility
edited by Jörg Franke ... [et al.]
Publisher
  • Trans Tech Publications
Publication Year
  • c2014
Book size
24 cm
Series Name / No
  • : pbk
Other Title
  • 11th International Congress Molded Interconnect Devices : scientific proceedings : 3-D MID

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Notes

Includes bibliographical references and indexes

Other editors: Thomas Kuhn, Albert Birkicht and Andreas Pojtinger

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Details 詳細情報について

  • CRID
    1130000793820191104
  • NII Book ID
    BB18508935
  • ISBN
    9783038352525
  • Text Lang
    en
  • Country Code
    sz
  • Title Language Code
    en
  • Place of Publication
    • Pfaffikon
  • Data Source
    • CiNii Books
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