Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A.

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Bibliographic Information

Title
"Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A."
Statement of Responsibility
editors, Yong S. Cho ... [et al.]
Publisher
  • Materials Research Society
Publication Year
  • c2005
Book size
24 cm

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Notes

Includes bibliographical references and indexes

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Details 詳細情報について

  • CRID
    1130000793856573440
  • NII Book ID
    BA73171529
  • ISBN
    1558997814
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • Warrendale, Pa.
  • Data Source
    • CiNii Books
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