Advances in hygrothermal performance of building envelopes : materials, systems and simulations

Symposium on Advances in Hygrothermal Performance of Building Envelopes: Materials, Systems and Simulations, Mukhopadhyaya, Phalguni, Fisler, Diana, ASTM Committee C-16 on Thermal Insulation, ASTM Subcommittee C16.33 on Insulation Finishes and Moisture, American Society for Testing and Materials

Advances in hygrothermal performance of building envelopes : materials, systems and simulations

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書誌事項

タイトル: "Advances in hygrothermal performance of building envelopes : materials, systems and simulations"

責任表示: editors, Phalguni Mukhopadhyaya and Diana Fisler

出版者

ASTM International

出版年月

c2017

書籍サイズ: 23 cm

タイトル別名

STP1599

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注記

"Contains peer-reviewed papers that were presented at a symposium held October 26-27, 2016, in Orlando, Florida, USA. The workshop was sponsored by ASTM International Committee C16 on Thermal Insulation and Subcommittee C16.33 on Insulation Finishes and Moisture"--Foreword

"ASTM stock #STP1599"--T.p.

Includes bibliographical references

DOI: 10.1520/STP1599-EB

Advances in hygrothermal performance of building envelopes : materials, systems and simulations

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Advances in hygrothermal performance of building envelopes : materials, systems and simulations

書誌事項

この図書・雑誌をさがす

注記

関連図書・雑誌

詳細情報 詳細情報について

書き出し

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