Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

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Bibliographic Information

Title
"Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California"
Statement of Responsibility
sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.]
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1995
Book size
28 cm

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Notes

Includes bibliographical references and index

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