Materials and processes for wireless communications

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Bibliographic Information

Title
"Materials and processes for wireless communications"
Statement of Responsibility
edited by T. Negas, H. Ling
Publisher
  • American Ceramic Society
Publication Year
  • c1995
Book size
24 cm

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Notes

"Proceedings of the Symposium on Materials and Processes for Wireless Communication, held at the American Ceramic Society Electronics Division Meeting with the International Society for Hybrid Microelectronics, November 15-17, 1994, in Boston, MA"--T.p. verso

Includes index

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