Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado

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Bibliographic Information

Title
"Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado"
Statement of Responsibility
sponsored by ISHM--the Microelectronics Society ... [et al.] ; in cooperation with SEMI--Semiconductor Equipment and Materials International, IPC--the Institute for Interconnecting and Packaging Electronic Circuits, SPIE--the International Society for Optical Engineering
Publisher
  • SPIE
Publication Year
  • c1994
Book size
28 cm
Other Title
  • 1994 proceedings : International Conference and Exhibition on Multichip Modules

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