Ceramic substrates and packages for electronic applications
Bibliographic Information
- Title
- "Ceramic substrates and packages for electronic applications"
- Statement of Responsibility
- edited by Man F. Yan ... [et al.]
- Publisher
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- American Ceramic Society
- Publication Year
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- c1989
- Book size
- 25 cm
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Notes
"Proceedings of the International Symposium on Ceramic Substrates and Packages, sponsored by the Electronics Division of the American Ceramic Society and the Ceramic Society of Japan, held in Denver, CO, on October 18-21, 1987"--T.p. verso
Includes bibliographical references
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Details 詳細情報について
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- CRID
- 1130000795575773184
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- NII Book ID
- BA1037108X
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- ISBN
- 0916094359
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- LCCN
- 89018365
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- Web Site
- https://lccn.loc.gov/89018365
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- Westerville, Ohio
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- Classification
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- LCC: TK7871.15.C4
- DC20: 621.381
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- Subject
-
- Data Source
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- CiNii Books