Semiconductor Wafer Bonding : Science, Technology, and Applications

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Bibliographic Information

Title
"Semiconductor Wafer Bonding : Science, Technology, and Applications"
Statement of Responsibility
editors, H. Baumgart ... [et al.] ; sponsoring division, Electronics and Photonics
Publisher
  • Electrochemical Society
Publication Year
  • c2006-
Book size
23 cm
Series Name / No
  • 9
  • 10

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Notes

"... held in Cancun, Mexico, as part of the 2006 Fall Meeting of The Electrochemical Society" -- 9

"... held in Honolulu, Hawaii, on October 14-16, 2008, as a part of the Pacific Rim Meeting, PRiME 2008: joint International Meeting of the 214th Meeting of ECS-The Electrochemical Society, and the 2008 Fall Meeting of The Electrochemical Society of Japan" -- 10

Includes bibliographical references and indexes

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Details 詳細情報について

  • CRID
    1130000795816683264
  • NII Book ID
    BA81682895
  • ISBN
    156677506X
    9781566776547
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • Pennington, N.J.
  • Data Source
    • CiNii Books
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